Light Emitting Diodes (LEDs) and smartphones have dramatically enriched society in recent years.
Compound semiconductors, with their unique characteristics, are indispensable materials in the core components of these epoch-making devices. Taiyo Nippon Sanso has been a first mover in the development of MOCVD equipment, which is needed in the manufacture of compound semiconductors, and this equipment has received praise for its world-class performance stability.
Taiyo Nippon Sanso CSE is a wholly owned subsidiary of Taiyo Nippon Sanso, and we are responsible for the design and manufacture of the MOCVD equipment that our parent company supplies to the world. We intend to capitalize on the advanced engineering technology that we have acquired independently and to contribute to society’s future development.

Taiyo Nippon Sanso CSE’s MOCVD Equipment

MOCVD equipment consists of a source material supply unit, which precisely introduces the source material to the reactor; a reactor, which deposits the thin films of compound semiconductors on the wafers; an exhaust pressure control unit which controls the pressures within the reactor; and an electric control system, which centrally manages these components. Taiyo Nippon Sanso CSE applies the proprietary gas handling technologies it has cultivated over many years to provide MOCVD equipment that meets our clients’ diverse needs.


Whether designing mechanical components or mapping the piping layout, we find ourselves in many situations that require CAD.


Machined components, in quantities anywhere from several hundred to thousands, are sent to the assembly line after each part undergoes strict inspection.
Assembling the equipment requires mechanical component assembly, piping assembly, electric system assembly, and various other technologies, so in-house experts in all fields work together to assemble the equipment.

Deposition Test

We perform deposition tests on all completed equipment before delivering to our clients. Taiyo Nippon Sanso CSE employs engineers who understand process technologies, and they are able to create demo samples at Taiyo Nippon Sanso’s Tsukuba Laboratory and evaluate the quality of the deposition process.

Our Company

Taiyo Nippon Sanso CSE promotes innovation that contributes to the sustainable development of the Taiyo Nippon Sanso Group, while working together with Taiyo Nippon Sanso’s innovation division, development division, and Tsukuba Laboratory. We take advantage of our advanced technological capabilities and our design and production know-how—independently developed over many years of experience in MOCVD equipment design and production—and we strive to break new ground in our business endeavors.

Address 6-2 Kojimacho, Kawasaki-ku, Kawasaki, Kanagawa at the TAIYO NIPPON SANSO KEIHIN FACTORY
Tel: +81-44-288-5791
President Takashi Aida
Founded February 1, 2008
Capital 30 million yen
(wholly owned subsidiary)
Businesses Design and manufacturing of compound semiconductor fabrication equipment, engineering services, and field services
Certification ISO 9001

Taiyo Nippon sanso CSE LTD.

6-2 Kojimacho, Kawasaki-ku, Kawasaki, Kanagawa
(at the Taiyo Nippon Sanso Keihin Plant)
Tel: +81-44-288-5791

From Kawasaki Station (East Gate)
• By bus
K03 Line from Platform 16
Board the Rinko bus for Ukishima Bus Terminal
Get off at Kojimacho and walk for 5 minutes
* Traveling by bus takes approximately 30 minutes

From Kojimashinden Station
• By taxi, approximately 5 minutes
• On foot, approximately 25 minutes


1980 Nippon EMC Ltd. is established and starts manufacturing and sales of MOCVD manufacturing equipment
1983 Nippon Sanso Corporation starts MOCVD business
1996 ASEC Inc. is established
2004 Nippon Sanso Corporation and Taiyo Toyo Sanso Corporation merge to form Taiyo Nippon Sanso Corporation
2007 Nippon EMC Ltd. assigns MOCVD business to Taiyo Nippon Sanso EMC Ltd.
2008 Taiyo Nippon Sanso EMC Ltd. is established
2009 Taiyo Nippon Sanso EMC Ltd. and ASEC Inc. merge their respective MOCVD businesses
2014 Taiyo Nippon Sanso EMC Ltd. and the Design Section of Taiyo Nippon Sanso Corporation Compound Semiconductor Equipment Div. merge to form Taiyo Nippon Sanso CSE Ltd. and moves to a new head office

Interview with company members